Borevo
Borevo
Deploy next-generation server clusters with direct manufacturer support. In-stock options custom-configured to enterprise, storage, and AI inference requirements.
In the contemporary hybrid-cloud and high-performance computing (HPC) landscape, HPE ProLiant architectures represent the benchmark for secure, scalable, and versatile hardware execution. As hardware requirements shift toward high-density computing arrays, localized application integration, and specialized thermal management, sourcing infrastructure through verified manufacturing pipelines has become a primary bottleneck for enterprise operators globally.
We provide end-to-end integration and custom board configurations, delivering server frameworks designed around standard HPE layouts (such as the ProLiant DL380 and DL360 families) alongside cutting-edge GPU and liquid-cooling enhancements. Through customized BIOS setups, physical layout alterations, and comprehensive hardware verification, our facilities guarantee that your enterprise infrastructure is tailored directly to your specific workflow loads, without standard supply chain delay structures.
Maximizing raw computing output within 1U and 2U frameworks through liquid-cooling integration and optimization of EDSFF configurations.
Securing systems down to the silicon footprint with custom security processors and secure boot features that secure operations from day one.
Implementing innovative liquid and air thermal distribution setups to reduce power usage effectiveness (PUE) metrics in deep-learning arrays.
Analyzing technical developments in Intel® Xeon® Scalable and AMD EPYC™ processors across ProLiant compute designs.
Transitioning from Gen11 platforms to the newly engineered Gen12 designs represents a major change in raw data pathing. By utilizing DDR5 system memory alongside PCIe Gen5 bus structures, Gen12 systems increase system bandwidth capacity, matching demands for high-frequency trading platforms, deep learning model deployments, and real-time database lookups.
Through advanced liquid cooling solutions in models like the DL360 Gen12, companies can safely run higher thermal-profile processors without thermal throttling, maintaining performance consistency while keeping server rack space requirements tight.
| Architecture Feature | HPE ProLiant Gen11 | HPE ProLiant Gen12 |
|---|---|---|
| Memory Standard | DDR5 (Up to 4800 MT/s) | DDR5 (Up to 6400+ MT/s) |
| I/O Protocol | PCIe Gen5 (Standard lanes) | PCIe Gen5 / CXL 2.0 Integration |
| Thermal Configuration | Standard Multi-Fan Air Cooling | High-Density Liquid & EDSFF Airway |
| Inference Scaling | Up to 2 Double-Wide GPUs | Up to 3+ Tri-Slot Accelerator Cards |
Our strategic partnership with Borevo AI Infrastructure (China) Co., Ltd. combines specialized research and development with flexible manufacturing capabilities. Operating from an 18,600 ㎡ advanced production complex, Borevo works at the center of customized server assemblies, AI acceleration platforms, and high-frequency data center layouts.
Our 45-person Quality Control team manages quality checks at every level. Using automated optical inspection (AOI), thermal test cycles, and structural electrical testing, each system is verified under heavy performance loads before shipment.
Whether you require customized firmware code, specialized PCB trace patterns, or customized server node dimensions, our 180 R&D engineers construct custom builds to fit your network demands.
Through a network of over 850 strategic partners globally, we secure high-speed memory modules, advanced PCBs, cooling assemblies, and processors, helping insulate customers from market shortages.
Leveraging China's advanced manufacturing ecosystem to deliver resilient, cost-effective server deployments.
By base-building our systems within China's primary high-tech manufacturing corridors, we leverage close integration with leading semiconductor packaging facilities, high-layer PCB fabricators, and advanced cooling specialists. This physical proximity allows us to rapidly secure raw raw materials and components, develop early prototypes, and move into volume production much faster than competitors in other regions.
For global procurement departments, this speed helps shorten project timelines. From finalizing design specifications to shipping customized, rack-ready server enclosures, our processes are built for rapid, reliable delivery without compromising on regulatory compliance.
Our custom-engineered HPE-based platforms and high-density GPU accelerators are deployed across diverse industries, solving complex computing tasks with high reliability:
Deploying custom GPU servers, including models configured for DeepSeek architectures, enabling mid-tier and enterprise organizations to run locally-hosted language models securely behind their corporate firewalls.
Integrating short-depth rack platforms within manufacturing facilities, utilizing localized AI nodes to analyze visual inspection data, run automated assembly equipment, and monitor facility sensors in real time.
Providing scalable virtualization configurations with the ProLiant DL380 and DL360 lines, supporting container orchestration setups and high-speed database applications with low latency.
As system heat levels climb with high-end CPUs and dense GPU nodes, traditional air cooling is reaching its limits. Our design roadmap emphasizes direct-to-chip liquid cooling loops and closed-loop setups in 1U and 2U systems, allowing data centers to support high thermal TDP chips while lowering overall cooling costs.
We are actively developing hardware platforms that support Compute Express Link (CXL 2.0/3.0), allowing dynamic sharing of system memory resources across processors and accelerators. This configuration reduces memory bottlenecks, improving efficiency for database lookups and complex AI processing workloads.
By collaborating closely with leading semiconductor vendors and storage manufacturers, we integrate high-speed EDSFF storage slots and PCIe Gen5 systems directly into our chassis designs. This enables maximum read/write performance per rack unit while maintaining excellent system airflow.
Common inquiries regarding server manufacturing capabilities, customization options, and global support structures.
Our customized solutions use standard HPE ProLiant base configurations (such as the DL380 or DL360 chassis) but add tailored component options. This includes specialized memory configurations, specific RAID controllers, modified BIOS parameters for lower latency, or customized GPU mounting layouts. This allows customers to receive systems optimized for their precise workloads, bypassing generic component shortages.
Our manufacturing facility utilizes a structured testing process led by 45 dedicated QC personnel. Each completed server undergoes automated optical inspection (AOI), high-temperature burn-in tests, and full interface validation (testing all network, memory, and expansion ports under maximum load) to verify stability and hardware integrity prior to export.
We provide clear hardware warranty terms for our international clients. In the event of a component issue, we diagnose the failure remotely and ship replacement parts (such as replacement drives, memory DIMMs, power supplies, or fan modules) via expedited global shipping channels. For complex system issues, we arrange depot repair or complete module replacements to minimize downtime.
Yes, our systems are built using standard x86 and industry PCIe architectures, ensuring compatibility with all major operating systems (RHEL, Ubuntu, Rocky Linux, Windows Server) and virtualization platforms. They are fully optimized to run advanced AI engines and orchestration systems, including Kubernetes, PyTorch, TensorFlow, and custom DeepSeek LLM setups.
Working closely with over 850 localized supply chain partners allows us to procure raw PCBs, chassis parts, power components, and cooling assemblies directly. This direct access minimizes transit delays, allowing us to build, configure, test, and ship custom systems in significantly less time than standard distribution channels.
Inside our advanced manufacturing centers, cleanroom assembly lines, and thermal performance testing areas.
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