Borevo Borevo

Top China Server Cooling Solutions Manufacturers & Exporters

Innovative Thermal Infrastructure and High-Performance GPU Computing Solutions Tailored for Next-Generation Data Centers.

Addressing the Thermal Imperative of Modern AI Compute Infrastructure

The explosive rise of large language models (LLMs) such as DeepSeek, GPT-4, and compute-heavy AI inference workloads has fundamentally changed data center engineering. Standard thermal structures are struggling. Standard heat sink components can no longer cope with the heat generated by the latest GPUs, where TDP values exceed 700W per accelerator card.

As a leading hardware integration pioneer, Borevo AI Infrastructure (China) Co., Ltd. integrates high-density system designs with liquid-to-air, direct-to-chip, and advanced hybrid heat dissipation systems. By optimization at the architectural level, we ensure systems operate continuously under peak loads while maintaining an optimal Power Usage Effectiveness (PUE) below 1.15.

Operational Capabilities & Scale

  • Established: 2018
  • Total Manufacturing Floor: 18,600 ㎡
  • Annual Export Volume: USD 18 Million
  • R&D Engineers: 180 Experts
  • Dedicated Quality Assurance: 45 QC Personnel
  • New Products Released Annually: 120+ Products

Technology Roadmap & Thermal Engineering Outlook

The progression of server cooling systems from traditional forced air models to two-phase immersion systems.

Phase 1: Advanced Intelligent Air Cooling

Employs copper 3D vapor chambers, micro-channel high-performance heatsinks, and counter-rotating fan systems. Best suited for workloads up to 35 kW per rack, balancing implementation costs with reliable mechanical airflow design.

Phase 2: Hybrid & Rear-Door Heat Exchangers (RDHx)

Utilizes air-to-liquid heat exchangers built directly into the server cabinet rear door. Capable of neutralizing heat output at the rack level, removing the need for heavy modifications to building chilled water systems.

Phase 3: Direct-to-Chip (D2C) Liquid Cooling

Circulates dielectric fluid or treated water directly through micro-channel cold plates mounted on the CPU/GPU die. Manages heat levels exceeding 100 kW per rack, capturing 80-90% of total server heat output directly at the source.

Phase 4: Immersion Liquid Cooling (Single & Two-Phase)

Submerges entire servers directly inside a specially formulated dielectric fluid. Offers maximum thermodynamic efficiency, eliminates fans, minimizes moving parts, and provides silent, low-energy thermal management for extreme AI clusters.

Macro-Level Data Center Cooling Solutions

We deliver comprehensive thermal management architectures optimized for diverse environments, ranging from edge nodes to hyper-scale cloud data centers.

Hyperscale & Cloud Centers

Custom designs using centralized Cooling Distribution Units (CDUs) and secondary loops. We optimize cooling flow distribution to lower Power Usage Effectiveness (PUE), helping operators meet strict government environmental targets.

High-Density AI Clusters

Optimized for GPU deployments handling heavy deep learning workloads. Incorporates split liquid-to-air cooling setups and customized direct-to-chip copper blocks, designed to prevent thermal throttling during continuous compute runs.

Edge Computing Deployments

Closed-loop, dust-resistant cooling units tailored for small server enclosures and harsh field conditions. Engineered to maintain high reliability with minimal maintenance in remote settings.

China Factory 4.0: Supply Chain Resilience & Quality Excellence

Combining state-of-the-art automated manufacturing with a highly integrated components supply chain to deliver reliable computing systems globally.

18.6K ㎡
Factory Floor Area
180
R&D Engineers
45
QC Inspectors
850+
Supply Chain Partners
120
New Products Annually

Systematic Testing & Quality Assurance (QA)

To ensure long-term performance and leak-free operation, Borevo enforces a rigorous multi-stage quality control protocol across all server configurations:

1. Component-Level AOI

Automated Optical Inspection (AOI) identifies surface defects on PCBs, riser cards, and electrical interfaces prior to final assembly.

2. Thermal Stress Testing

Modules undergo extensive climate chamber testing under varying temperature loads to guarantee structural integrity.

3. High-Load Burn-In

Assembled servers run at 100% capacity for extended periods to verify electrical, compute, and thermal stability.

4. Helium Leak Detection

Liquid cooling components undergo high-sensitivity helium mass spectrometry testing to ensure long-term, leak-proof operations.

Global Compliance, Customization & Engineering Support

We provide full customization (OEM/ODM) to meet specific layout, power, and thermal density requirements. Our engineering team assists with fluid dynamics analysis, custom cold plate prototyping, and adjustments to electrical schematics.

All exports conform to international standards, including CE, UL, RoHS, and FCC certifications. Additionally, our global distribution network ensures timely access to replacement parts and engineering assistance across North America, Europe, and Southeast Asia.

Design Integration & Engineering

Tailored modification of server chassis, liquid loop pathways, cold plate profiles, and control systems to fit your pre-existing network infrastructure.

Predictable SLA & Support

Comprehensive warranty coverage, step-by-step installation support, and system health monitoring guidelines to minimize potential operational downtime.

Manufacturing Facilities & Production Control

A look inside our 18,600 ㎡ state-of-the-art server assembly lines, testing chambers, and quality control departments.

Production Facility Area 1
Production Facility Area 2
Production Facility Area 3
Production Facility Area 4
Testing Facility Area 1
Testing Facility Area 2
Consolidated Processing Line

Expert Q&A: Liquid & Server Cooling

Addressing the technical, operational, and financial considerations essential for server room upgrades.

At what power density does transitioning from air to liquid cooling become necessary?
Typically, standard forced-air systems can manage thermal loads up to 15-20 kW per rack. When power densities reach 30 kW to 35 kW per rack, air cooling systems require high fan speeds, which increases ambient noise and power consumption. For high-density setups exceeding 40 kW per rack—such as those housing advanced GPU configurations—liquid cooling is highly recommended to prevent performance throttling and improve overall reliability.
What is the difference between Direct-to-Chip (D2C) and Immersion cooling?
Direct-to-Chip (D2C) is a hybrid method where liquid loops flow directly to cold plates secured on hot processors, leaving the rest of the chassis to be cooled by traditional fans. Immersion cooling removes all internal fans by submerging the entire server directly in a non-conductive dielectric fluid. D2C allows operators to reuse existing rack designs, while immersion offers maximum thermodynamic efficiency and minimal mechanical wear.
How does Borevo prevent liquid leaks in direct-to-chip setups?
We employ a multi-layered prevention strategy: using high-durability EPDM hoses, double-sealed leak-proof quick disconnects, and helium leak testing during production. Additionally, we integrate specialized water-wicking leak detection cables inside the server chassis that link directly to the baseboard management controller (BMC) to trigger automatic shutoffs if fluid is detected.
Are these systems compatible with legacy server architectures?
Yes. Rear-Door Heat Exchangers (RDHx) and secondary cooling loops can be integrated with existing data center setups. This enables high-density deployments without needing a complete overhaul of the building's main water infrastructure.
What support SLAs does Borevo provide to international clients?
Borevo provides customized SLAs based on procurement requirements, including remote technical assistance, warranty replacement programs, and dedicated field engineers for major data center installations.