Borevo
Borevo
Engineered for Brazilian Data Centers, ISPs, and High-Performance Enterprise Deployments.
Brazil’s digital economy is experiencing a massive transformation. Driven by the expansion of the 5G network backbone, advanced fintech applications such as real-time payment architectures (PIX), and industrial automation in agribusiness and mining, the demand for enterprise-grade network fabrics has scaled significantly.
However, importing finished IT equipment into Brazil is complex. System integrators face import duties (IPI, ICMS, PIS, COFINS) and rigid compliance processes, specifically ANATEL certification (Agência Nacional de Telecomunicações). The local market requires networking switches that combine international standards of reliability with flexible SKU configurations to optimize tariff structuring (such as SKD/CKD assembly pathways).
At Borevo AI Infrastructure, we design and manufacture network hardware to address these localized barriers. Our systems are engineered to withstand tropical climate conditions (high humidity and temperatures) in remote agricultural and mining nodes while meeting the rigorous energy efficiency requirements of hyperscale cloud infrastructures in Brazil's major metropolitan areas.
Engineered to support regional deployments and heavy industrial connectivity challenges.
Our Layer 3 switches feature ultra-low latency routing and high throughput, designed to manage high-frequency financial transactions for banking networks in Faria Lima and Paulista.
Specially engineered with wide temperature ranges and ruggedized protection class ratings to connect remote IoT sensor arrays and automated equipment in Mato Grosso's agricultural fields.
Designed for demanding environments in Minas Gerais and Pará, our products offer redundant power supplies and electromagnetic immunity to ensure continuous operation in mining operations.
Working with a specialized manufacturer in China provides substantial supply chain advantages. Our integration allows us to optimize component sourcing, streamline automated optical inspection (AOI), and implement rigorous board-level testing to achieve high reliability at a competitive cost structure.
Adapting to the next wave of high-density computing, cloud fabrics, and AI workloads.
The international networking industry is moving rapidly toward disaggregated hardware architectures, where open network operating systems (such as SONiC) run on white-box silicon. This trend is gaining traction in Brazil, allowing operators to escape vendor lock-in and significantly lower licensing costs.
Additionally, the rise of AI computing requires data centers to deploy high-bandwidth spine-leaf networks. High-density 100G and 400G optical interfaces are quickly transitioning from premium options to baseline requirements. Our manufacturing facilities are equipped to support these standards, utilizing optical sub-assemblies and silicon photonics packaging technologies to meet evolving specifications.
Every product is tested to meet international standards and ensure long-term stability.
Automated optical systems inspect solder joints, component placement, and board alignments to detect microscopic defects.
Boards undergo dynamic thermal stress testing in specialized environmental chambers to ensure material integrity under extreme conditions.
Rigorous verification of power supply stability, impedance matching, and high-frequency signal integrity.
Every switch and server runs under maximum workloads for extended periods to confirm long-term system stability before shipping.
Explore our full line of rack systems, GPU-accelerated nodes, and expansion components configured to meet international data center standards.
Technical answers regarding network hardware importing, customization, and local deployment in Brazil.
Yes, we coordinate directly with Brazilian system integrators and authorized testing bodies to assist in obtaining ANATEL certification for our hardware. We provide all necessary safety, electromagnetic compatibility (EMC), and RF test reports generated by accredited international laboratories to streamline approval processes under Resolução 715.
We offer flexible shipping arrangements, including CKD (Completely Knocked Down) and SKD (Semi-Knocked Down) packaging alternatives. This allows local system integrators to perform final assembly and testing in Brazil, leveraging favorable local taxation rates and reducing overall tariff impact.
Our platforms support standard network protocols (like LACP, OSPF, BGP, and PIM) and offer optional support for open-source network operating systems like SONiC. This ensures seamless integration with existing network environments, including major local exchanges (IX.br) and standard telecom architectures.
We provide comprehensive hardware and software customization. Our engineering team can modify PCB layouts, adjust thermal performance with custom fan and heat-sink assemblies, write custom bootloader firmware, and apply custom branding to chassis and packaging.
Every unit undergoes a comprehensive multi-stage testing process. This includes Automated Optical Inspection (AOI) after board assembly, high-temperature dynamic burn-in tests to identify infant mortality failures, and functional testing to verify port speeds, routing performance, and hardware stability.
Collaborate with an experienced manufacturer to access custom OEM/ODM solutions, robust quality control, and optimized shipping configurations for the South American market.
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