Borevo
Borevo
High-density processing cores, specialized high-speed interconnects, and resilient caching systems built for scale.
Bridging the gap between raw hardware design and global bare-metal dedicated hosting distribution.
As a specialized AI GPU manufacturer and dedicated hosting hardware provider, Borevo AI Infrastructure (China) Co., Ltd. serves the technological backbone of global scale-out computing markets. With a strict focus on GPU design integration, AI acceleration systems, and customized bare-metal computing architectures, we engineer the physical layer of the modern cloud.
Through continuous innovation in heterogeneous server design and thermal packaging, Borevo enables global providers to offer robust, unthrottled performance. We export advanced computing node configurations worldwide, matching industry-leading quality benchmarks with structural price advantages.
Customized physical architectures designed to solve compute, thermal, and security challenges in data-heavy sectors.
Deploying massive compute density with ultra-low thermal resistance. Our high-density 1U and 2U multi-socket bare-metal configurations are engineered for low PUE (Power Usage Effectiveness) performance in high-density data spaces.
Eliminating processing bottlenecks with sub-millisecond execution loops. High-capacity RAID controller integration (LSI Cache architectures) coupled with enterprise NVMe storage pipelines ensures sustained IOPS and minimal write latencies.
Unleashing parallel computation via dedicated hardware pipelines. Optimized for modern massive model inferences, including the containerized deployment of DeepSeek R1 671B networks on physical clusters with direct PCIe pathing.
Every system board undergoes rigorous electrical, structural, and thermal verification before leaving our assembly bays.
Dedicated hosting nodes demand 100% operational uptime. A single micro-fracture on a PCB or a faulty memory cache register can cause data corruption in a bare-metal cloud infrastructure. Borevo addresses this risk through our structured Quality Inspection System, supported by 45 dedicated Quality Control personnel.
In-depth component level checks including semiconductor structural scanning and silicon layout validation.
Automated high-definition optical inspection scanning for precise soldering, circuit integrity, and component alignment.
Extreme environment exposure testing heat dissipation capability, component lifecycle stability under intensive cycles.
Rigorous processing throughput and network card load testing under production-simulated network densities.
Designing flexible, high-density host platforms optimized for customized infrastructure needs.
Modern bare-metal hosting architecture is shifting from generic compute boxes to application-optimized heterogeneous architectures. To maintain a competitive edge, Borevo's R&D engineering team, consisting of over 180 experienced engineers, released 120 new products last year. This aggressive roadmap focuses on four primary engineering vectors:
As processing capabilities multiply, system performance is often bottlenecked by data transit speeds. By incorporating PCIe Gen 5 architecture across all our latest enterprise rack designs, we enable double the throughput of older standards. This guarantees that connected arrays, high-speed storage components, and network cards operate with maximum data flow efficiency.
Borevo supports deep-level configuration adjustments. Our design processes allow customers to optimize:
| Technical Category | Standard Configuration Range | Customization Level Available |
|---|---|---|
| Processor Options | Intel Xeon Scalable / AMD EPYC Processors | Custom BIOS settings, specific thermal targets |
| Memory Interfaces | 8-Channel / 12-Channel DDR5 & DDR4 up to 4800MT/s | Dimm layout optimization, customized cooling jackets |
| Data Interconnects | PCIe Gen 5.0, NVLink, OCP 3.0 Network Adapters | PCIe pathway routing adjustments, riser designs |
| RAID & Cache Control | LSI Tri-Mode Cards (e.g. 9560-16I 8GB Cache) | Supercap placement, flash cache size configurations |
| Thermal Dissipation | Dual-rotor redundant fans, multi-stage vapor chambers | Closed-loop liquid cooling integrations |
Serving over 850 strategic partners across North America, Europe, and Southeast Asia.
Exporting hardware systems to major international data centers requires more than just high-quality assembly. It demands compliance with international security and environmental standards, seamless supply chains, and reliable logistics structures.
Borevo coordinates with a strategic network of 850 supply chain partners, guaranteeing access to high-grade semiconductors, high-density PCBs, advanced cooling modules, and memory components even during market supply volatility. Our logistics team handles export clearance, regional safety certifications (such as CE, FCC, RoHS), and door-to-data-center shipping pipelines.
Addressing operational, logistics, and system integration queries for global procurement partners.
Inside our 18,600 ㎡ high-capacity production facility, featuring advanced automated assembly lines and validation bays.
High-density processors, redundant power supply architectures, and scalable cache systems optimized for critical computing tasks.
