Borevo
Borevo
High-availability solutions engineered for data centers, virtualization, and GPU acceleration workloads.
Why next-generation workloads demand specialized high-density 6U server form factors.
Modern Large Language Models (LLMs), neural networks, and intensive HPC workloads produce massive thermal dissipation requirements. Traditional 1U and 2U rack form factors are highly constrained by height limits, restricting the physical placement of multi-card GPU topologies and liquid-cooled blocks. A specialized 6U rack chassis provides the crucial structural volume required to optimize structural layout and hot-swap components.
With an increased physical height of 10.5 inches (266.7 mm), 6U rack servers support:
Standard rack cabinets host 42U of space. Utilizing custom 6U server nodes allows data center managers to balance power delivery constraints with spatial layout efficiency. Our OEM servers leverage structural steel alloy panels (SGCC 1.2mm) to prevent chassis sagging under heavy GPU structural loads (which can exceed 85 kg per unit).
Additionally, 6U rack enclosures provide sufficient backplane room to support PCIe Gen 5.0 signal integrity switches, OCP 3.0 network cards, and extensive SAS/SATA/NVMe storage drive bays without compromising computational density.
Empowering global digital transformation with elite AI infrastructure manufacturing capabilities.
Borevo AI Infrastructure (China) Co., Ltd. is a specialized AI GPU manufacturer dedicated to delivering high-performance computing hardware and advanced AI infrastructure solutions for global markets. The company focuses on GPU design integration, AI acceleration systems, and customized computing solutions for data-intensive applications.
Integrating a complete industry value chain from R&D and board-level PCB layout design to sheet metal stamping, assembly testing, and global logistics, Borevo provides elite-level Tier 1 OEM and ODM services for enterprises, research facilities, and hyper-scale cloud service providers.
Why leading global companies choose Chinese OEM fabrication for custom server platforms.
Borevo works with 850 strategic partners across the semiconductor, PCB, cooling system, and memory component sectors. This ecosystem guarantees stable lead times and raw material access during market shortages.
Our engineering facility turns complex system designs into functional mechanical and electrical prototypes. Structural design changes can be tested and iterated in days, not months.
By optimizing production routing, material utilization, and hardware integration steps, we deliver high-density computing platforms at a competitive Total Cost of Ownership (TCO).
Zero tolerance for hardware failure. Every system undergoes extensive environmental and computing tests.
High-density 6U server platforms must withstand long-term operational stress. Our quality inspection framework manages risks at every step, from parts arrival to shipment. With a dedicated team of 45 QC personnel, we utilize industry-recognized diagnostics to verify compliance and system stability:
Our engineering group consists of 180 R&D engineers focused on high-density power delivery, hardware signal integrity, and custom server layouts. Over the past year, we introduced 120 new products designed for emerging AI and cloud compute workloads.
Our capabilities include:
How our computing configurations match specific target markets and dynamic application requirements.
For Large Language Model (LLM) training and neural network operations, our 6U server layouts support high-speed GPU-to-GPU fabrics (NVLink/NVSwitch equivalents) and fast storage access.
Maximize container density per rack. Our custom 6U systems enable provisioning of dozens of isolated virtual instances, running high-frequency PCIe switching networks.
Ideal for real-time video analytics, rendering, seismic data processing, and clinical research projects that require robust compute power directly on-premises.
Deploying server infrastructure globally requires navigating regulatory frameworks and certification standards. Borevo supports clients through localized logistics support and product compliance. Our systems are manufactured to conform to target market regulations across North America, Europe, and Southeast Asia.
Beyond regulatory compliance, Borevo provides service level support to guarantee continuous operation:
Anticipating technological advancements to keep your data centers ahead of the curve.
As GPU thermal dissipation approaches 700W+ per processor, air cooling reaches its limits. Future 6U chassis models are optimized for direct-to-chip liquid cooling manifolds.
Compute Express Link (CXL) is standardizing unified memory access pools. Our R&D teams are integrating Gen 6.0 routing layouts to maintain signal integrity.
Power usage effectiveness (PUE) is a key metric. Modern systems feature titanium-grade efficient power supplies and intelligent sleep states to reduce idle power draw.
Inside Borevo's 18,600 ㎡ high-performance hardware manufacturing facility.
Frequently asked questions regarding order processes, technical customizations, and factory operations.
High-performance network cards, raid storage adapters, and scalable rack server nodes.
