Borevo
Borevo
Engineered for extreme thermal workloads, high density setups, and hybrid cloud data center optimization.
Borevo is a specialized AI GPU and thermal design manufacturer dedicated to delivering high-performance computing hardware and advanced AI infrastructure solutions for global markets. We focus on GPU design integration, AI acceleration systems, and custom server cooling architectures.
With over a decade of domain expertise, our engineered solutions tackle the ultimate thermal limits of the latest GPU clusters, ensuring low Power Usage Effectiveness (PUE) and long-term hardware reliability.
Analyzing thermodynamic thresholds and energy footprint metrics in hyperscale AI infrastructures.
As deep learning algorithms, large language models (LLMs like DeepSeek), and scientific computing clusters grow exponentially, standard air cooling systems are reaching their physical limits. A modern AI GPU node can pull upwards of 700W to 1000W+ per accelerator chip. Multiply this by millions of parameters and thousands of interconnected server racks, and the heat density scales past 40kW to 100kW per cabinet.
Conventional Air Cooling (CRAC/CRAH systems) requires massive airflow volumes, high velocity, and large spaces, consuming valuable data center real estate while driving up PUE (Power Usage Effectiveness) levels. This creates an unsustainable energy footprint and reduces chip lifespans due to hot spots. To combat this, advanced liquid cooling technology is changing from an optional design decision to a strict baseline requirement.
Direct-to-chip microchannel copper cold plates are mounted directly on CPU/GPU heat spreaders. Thermal energy is absorbed via specialized coolant loops, bypassing rack space barriers and delivering up to 90% heat extraction efficiency directly at the source.
Single-phase and two-phase immersion systems submerge the entire server hardware assembly in non-conductive dielectric fluid. This design eliminates fans, simplifies mechanical server design, and achieves ultra-low PUE values (<1.10) for maximum thermodynamic efficiency.
For modular configurations and mixed deployments, Hybrid Coolant Distribution Units (CDUs) manage pressure, flow rates, and heat rejection processes, allowing seamless transition from classic air setups to high-power liquid-cooled operations.
The industry's technical trajectory is shifting towards standardized, modular architectures. The future of data center thermal management lies in Phase-Change Immersion and Smart Micro-CDUs managed by AI telemetry software. At Borevo, our research roadmaps target:
How enterprise organizations, hyperscale host providers, and research centers structure their cooling configurations.
Different industrial workloads demand specialized structural configurations. A one-size-fits-all approach leads to either expensive over-engineering or high hardware failure rates. Below is a breakdown of our thermal architecture solutions by industry application:
Designed for multi-tenant cloud architectures running high-density Xeon, EPYC, and custom GPU blades. Utilizing highly efficient CDUs and dry cooler systems to guarantee low PUE, ensuring maximum SLA compliance and lowered utility costs.
Specifically engineered for dense training nodes (e.g. H100, B200 setups). Uses customizable Direct-to-Chip cold plates coupled with rapid-disconnect fittings to secure maximum uptime, allowing clean hot-swapping during high-load training runs.
Edge nodes demand silent, dust-free, and self-contained cooling setups. Our sealed, single-phase immersion chassis offer autonomous thermal control with zero dependence on massive cleanroom facilities or complex HVAC maintenance schedules.
Behind our 18,600 ㎡ state-of-the-art facility, rigorous quality assurance, and global export infrastructure.
Operating a high-end thermal and AI hardware manufacturing center requires deep raw material security and advanced quality engineering. Borevo AI Infrastructure operates a state-of-the-art production facility in China, offering global wholesale clients major cost advantages, high production rates, and reliable system builds.
Every cold plate, manifold, and server chassis undergoes multi-stage inspections, including AOI inspection, long-duration burn-in testing, thermal stress analysis under synthetic workload simulations, and complete electrical validation tests.
We work with 850+ strategic partners in the semiconductor, copper extrusion, high-density polymer, and specialized coolant industries. This deep network safeguards our material pipeline, insulating wholesale buyers from global price volatility.
With 180 R&D engineers, we offer deep custom services: OEM/ODM hardware design, firmware adjustments, custom PCB alignments, mechanical thermal validation, and tailor-made rack layouts.
Our quality assurance division features 45 dedicated QC specialists who monitor every phase of the manufacturing process—from raw copper sourcing and precision CNC milling to helium-based leak testing and high-pressure fluid simulations. This ensures that every system shipped to North America, Europe, and Southeast Asia meets international data center safety and performance standards.
Ensuring cross-border compliance, certified hardware standards, and seamless logistics pipelines.
Deploying data center cooling hardware across borders requires compliance with strict safety and environmental standards. Borevo ensures smooth international shipping and deployment through clear certifications and localized support partnerships:
Complementary high-density computing server systems, server RAM, storage, and thermal cooling modules.
Real-world snapshots of our R&D laboratories, mechanical production floors, and shipping yards.
Deep answers to essential questions on design, logistics, compliance, and custom hardware engineering.
