Borevo
Borevo
Explore our baseline high-performance server architectures, memory modules, and specialized RAID controller cards designed to eliminate data bottlenecks and maximize throughput in intensive application environments.
The rapid rise of generative Artificial Intelligence, complex multi-modal LLMs (such as DeepSeek-R1, Llama architectures), and hyperscale data applications has shifted the demand curve for enterprise server clusters. Traditional CPU-centric computing is no longer sufficient to process the massive parameters and token generation pipelines required by modern enterprises. Today’s industrial landscape demands specialized heterogeneous computing structures that tightly integrate high-performance GPU architectures, optimized interconnect fabrics, and ultra-reliable memory sub-systems.
As a leading high-performance computing manufacturer based in China, Borevo AI Infrastructure (China) Co., Ltd. bridges the gap between advanced micro-architecture designs and hardware production. Our engineering approach prioritizes low latency, maximized thermal dissipation efficiency, and structural customizability, enabling cloud service providers (CSPs) and research laboratories to deploy sustainable high-density rack systems globally.
For HPC clusters to deliver continuous performance without thermal throttling, optimization must start at the physical board level—utilizing premium PCBs, specialized firmware (OpenBMC), and advanced direct-to-chip liquid cooling loops.
Established in 2018, Borevo AI Infrastructure has evolved from a specialized system integrator to an industry-certified manufacturer of AI GPU platforms and custom server nodes. Our state-of-the-art manufacturing campus in China is optimized for high-volume production, rigorous QC validation, and scalable custom development pipelines.
With an 18,600-square-meter facility engineered to ESD safety standards, we execute precise automated hardware assembly, system verification, and rapid custom builds under strict climate-controlled conditions.
Supported by 180 design and electrical engineers, we specialize in custom system engineering, structural chassis modifications, specialized BIOS/UEFI development, and tailored cooling setups.
Through close partnerships with over 850 strategic suppliers of semiconductors, custom PCBs, memory modules, and cooling materials, we secure priority access to critical hardware components.
High-performance computing (HPC) requires precision design at every stage of the hardware pipeline. Below is our engineering roadmap, showcasing our dedication to resolving key limitations in signal stability, thermal management, and software-hardware integration.
As silicon power envelopes exceed 700W per accelerator card, our liquid cooling systems prevent thermal throttling. We design custom micro-channel cold plates, quick-disconnect configurations, and secondary coolant loops to keep high-performance nodes running optimally.
To minimize data loss over high-speed buses, our server layouts feature optimized multi-layer PCB routing, high-performance copper alloys, and active redrivers/retimers. This ensures reliable data paths across PCIe Gen 5.0 and Gen 6.0 interfaces.
We provide hardware-level root-of-trust protection alongside open-source OpenBMC and Redfish API integrations. This allows data center administrators to securely monitor and manage system health remotely.
Our research and development team is actively implementing Compute Express Link (CXL 2.0 / 3.0) protocols. By enabling direct memory expansion and resource pooling across PCIe architectures, we help data centers eliminate memory capacity limits and maximize performance in GPU-accelerated applications.
Manufacturing advanced high-performance computing hardware requires a reliable supply chain. Borevo leverages China's industrial networks to deliver high-quality hardware with consistent lead times.
Located near China's leading semiconductor and electronics clusters, our facility sources premium components—such as multi-layer PCBs and high-performance power modules—with minimal transport delays.
By working with over 850 strategic suppliers, we mitigate single-source component shortages. This helps maintain stable production timelines, even during market fluctuations.
Our flexible assembly lines handle both customized low-volume production runs and large-scale deployments, optimizing manufacturing costs and system design flexibility.
Our facility uses advanced testing protocols, automated SMT processes, and environmental simulation rooms to ensure each compute node meets strict industrial quality standards.
Borevo AI infrastructure is deployed across North America, Europe, and Southeast Asia. Our server nodes are designed to meet the computing demands of diverse modern industries.
Our multi-GPU rack architectures are optimized for training large language models (LLMs) and running high-throughput inference engines like DeepSeek-R1. High-frequency DDR5 memory, fast PCIe routes, and high-bandwidth interconnects support stable distributed cluster training.
For edge data centers, our custom compute configurations process multi-channel 4K video feeds in real-time. These systems assist municipal networks in managing smart traffic routing, security analysis, and localized IoT data processing.
Our systems run complex parallel algorithms for genomic mapping and molecular research. By reducing computing bottlenecks, they speed up discovery pipelines for life science laboratories and research universities.
Our server designs are adaptable for both centralized cloud clusters and decentralized edge environments. This flexibility ensures dependable computing power, whether deployed in high-density data centers or remote industrial locations.
At Borevo, reliability is our primary focus. We implement strict quality control protocols across all manufacturing phases to guarantee system stability and product longevity.
Our 45-person quality control team tests every component from arrival to final packaging. These procedures help verify system integrity and prevent field failures:
Our systems meet international safety and environmental guidelines, facilitating global deployment and regulatory compliance:
Read through our frequently asked technical questions regarding GPU integration, system cooling, OEM development, and export processes.
Browse our selection of rack servers and expansion accessories designed to scale operations from edge deployments to high-density data center environments.
